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Direct micro evaporator cooling of the silicon substrate where by the micro evaporator channels or features are etched into the silicon substrate and R134a refrigerant is pumped through the micro channels in a two phase latent heat cooling process. This approach is by far the most advanced and is only limited by the current state of the art power bus technologies. To the astute reader or engineers schooled in the art, he or she can comprehend the myriad of applications to this kind of cooling where watt densities can go beyond 500W/cm2. Other applications include but are not limited to, EV batteries that need to be kept cool while fast charging or high current discharging (Electric Vehicles). Mag LEV train switching gear (IGBT’s) would benefit along with hypersonic jet engine parts (Exhaust) and airframe structures to name a few. A note about server immersion cooling. We have studied the pros and cons of both latent heat and sensible heat immersion cooling. One of the most talked about latent heat immersion cooling processes utilizing 3M Novec fluids unfortunately have a fatal flaw where the $45,000 cost per rack of NOVEC fluid at $300-$400 per gallon has to be replaced due to evaporation. Some might argue that through proper design of condensing coils and good tank design practices this can be avoided or minimized. In the end however the very expensive Novec fluid will evaporate and the owner will be saddled with the cost of constant replacement. This cost of ownership ultimately effects the system capitol efficiency and should be disregarded. The sensible heat immersion cooling approach utilizing oil is better in terms of cost to operate but you must modify your servers for immersion in oil and you are limited to 10W/CM2 power density. Sensible heat immersion cooling has its place and works for some but it is only a step along the way to micro evaporator cooling pumped via an ORC system that spins a turbine to generate power for the data center. The ORC generator functions as follows: A constant subzero mass encapsulating the evaporation coils of the refrigeration cycle transfers external thermal energy from the data center servers into the working fluid of the cycle. Upon this discharge by the compressor, the working fluid rejects thermal energy out of the refrigeration cycle condensing coil into the thermally coupled Rankine cycle working fluid within the expansion tank. This thermal energy “hand-off” elevates the temperature and pressure of the Rankine cycle by the turbine while lowering the temperature and pressure of the refrigeration cycle working fluid enabling electrical power generation by the turbine while lowering the temperature and pressure refrigeration cycle working fluid in the condensing coil. Upon exiting the turbine the working fluid of the Rankine cycle enters a low pressure condensing tank thermally coupled to the sub-zero mass encapsulating the evaporation coils of the refrigeration cycle.
People use the touch-screen computers to surf the web, write e-mails, watch movies and read books. I just think about the touch computer mouse. It may be getting better when just touching the mouse will move.
Within the past year, Dell has slightly changed how they give version numbers to BIOS updates for newer models. For example, before this change BIOS version 1.1.9 gets replaced with 1.2.0. But after the change, instead 1.1.9 gets replaced with 1.1.10. Or, 1.9.1 gets replaced with 1.10.1. There is a problem with this change. When organizations use SCCM OSD imaging to update the BIOS, they often will WMI query the version number of the BIOS to see if it needs to be updated with the one on the server. However, it thinks that version 1.1.9 is higher than 1.1.10, because in reality 1.1.9 is a larger number, so it thinks the BIOS doesn't need to be updated but in reality it does. Please go back to the older BIOS numbering system
After all this time, those of us who are both owners of the much-beloved 1600n Dell printer AND users of the Linux operating system, we still need Dell to build and provide a 1600n driver for Linux OS.Obviously this isn't a fancy new idea, but it's an even more pressing one: an idea that's long overdue.
Ok here it goes for both alienware 15 & 171. Heat is still issue like other brands have more mesh at back. Dust may be issue but the gain of airflow will reduce temps significantly. Pls also make back cover of 15 & 16 so that one can buy it as optional accessory.2. The user have very old looking limited control on alienware i am watching same command centre past 5 years plus. Have a look at asus, lenovo, msi. The functionality and quality of software really outshines the alienware decade old look.3. Alienrespawn was best to get system restored, even though microsoft gave something new win win 10 still alien respawn is best and would take few seconds to restore entire ssd.4. Keep old loyal customers with you else with more offerings from other brands you will see people switching .5. Listen to feedback just do not document it.6. My laptop is new alienware 15 with 7820hk but the moment i enable overclocking via bios at OC level 1 it does not boot but throws win 10 not able to boot error.7. Both software and hardware needs more integration and something new for consumer to feel cared for.